- Features
- Specifications
- Video
Basic Information
Model Name: FPA-3030i5a
Features
The FPA-3030i5a supports smaller substrates which are 200mm or less in diameter.
- *A wide range of wafer sizes from 50mm (2inch) to 200mm (8inch) are supported.
- *Approximately a 17% productivity improves compared to its predecessor model (FPA-3030i5+) under 8inch wafer condition.
- *The new chamber temperature control system helps to reduce power consumption by approximately 20% compared to its predecessor model (FPA-3030i5+).
- *Process robustness is enhanced by adopting an Off-Axis Alignment Scope that supports Dark-Field alignment measurement.
Supports a variety of different wafer sizes and materials
The FPA-3030i5a can be equipped with a handling system that enables the selection of wafer diameters from 50mm (2inch) to 200mm (8inch) to support a variety of different compound semiconductor wafer sizes and materials.
Adopts an alignment scope with enhanced robustness
The FPA-3030i5a employs an off-axis alignment scope that measures wafer alignment marks through an optical path that does not pass through the projection lens, which can use a wide range of alignment illumination wavelengths. And by enabling alignment measurement with Dark-Field can enhance process robustness.
TSA (Through Silicon Alignment) is also available as an option to support a variety of customer manufacturing processes.
Reduces Cost-of-Ownership through newly redesigned hardware and software
Productivity is improved by approximately 17% compared to its predecessor model (FPA-3030i5+) under 8inch wafer condition by adopting hardware such as a new alignment scope that shortens the measurement time of the alignment mark and a faster handling system, and by renewing the software.
And the power consumption is reduced by approximately 20% compared to its predecessor model (FPA-3030i5+) by adopting the new chamber temperature control system.
Specifications
| Resolution | ≦ 0.35 µm |
|---|---|
| Reduction Ratio | 1:5 |
| Field Size | 20mm x 20mm（5inch）/ 22mm x 22mm（6inch） |
| Exposure Wavelength | i-line 365 nm |
| Reticle Size | 5 inch / 6 inch (Selection) |
| Wafer Size | 50mm(2inch) / 75mm(3inch) / 100mm(4inch) / 150mm(6inch) / 200mm(8inch) (Selection) |
| Overlay Accuracy | ≦ 40 nm |
| Main Body Dimensions | (W) 1,900× (D) 2,600× (H) 2,450mm (Included exhaust duct: 2650mm) |
| Major Options | Wafer Handling Kit for Special Substrates PC Remote Console GEM-compliant online software Pellicle Particle Checker Through Silicon Alignment |