Semiconductor Lithography EquipmentFPA-3030EX6KrF Stepper for IoT devices
- Features
- Specifications
Basic Information
Model Name: FPA-3030EX6
Features
FPA-3030EX6 steppers are compatible with a variety of special substrates & small-sized substrates
Equipped with the same Wafer Feeding System as the proven FPA-3030i5+ i-line stepper, the FPA-3030EX6 supports the handling of substrates of various materials, sizes and thicknesses used for manufacturing IoT & power devices.
The FPA-3030EX6 offers the highest level of performance among KrF excimer laser steppers
The performance of previous model FPA-3000EX6 steppers was inherited, and the highest-level of resolution (150 nm), overlay accuracy (25 nm) and productivity (throughput *121 wph) were achieved among KrF excimer laser steppers in the same class.
- *200 mm (8 inch) wafer, 60 shots
FPA-3030EX6 steppers are compatible with FPA-3000EX6 reticle and recipes
Compatibility with FPA-3000EX6 reticles and recipes allows effective use of existing facilities and assets.
Specifications
- Resolution
- ≦ 150 nm
- NA (Numerical Aperture)
- 0.65～0.50 (Variable)
- Reduction Ratio
- 1:5
- Field Size
- 22 mm x 22 mm
- Exposure Wavelength
- KrF 248 nm
- Reticle Size
- 6 inch
- Wafer Size
- 100 mm (4 inch), 125 mm (5 inch), 150 mm (6 inch), 200 mm (8 inch) (Selection)
- Overlay Accuracy
- ≦ 25 nm
- Major Options
- Wafer Handling Kit for Special Substrates
PC Remote Console
GEM-compliant online software
Pellicle Particle Checker