Semiconductor Lithography Equipment
FPA-3030EX6
KrF Stepper for IoT devices
- Features
- Specifications
Basic Information
Model Name: FPA-3030EX6
Features
FPA-3030EX6 steppers are compatible with a variety of special substrates & small-sized substrates
Equipped with the same Wafer Feeding System as the proven FPA-3030i5+ i-line stepper, the FPA-3030EX6 supports the handling of substrates of various materials, sizes and thicknesses used for manufacturing IoT & power devices.
The FPA-3030EX6 offers the highest level of performance among KrF excimer laser steppers
The performance of previous model FPA-3000EX6 steppers was inherited, and the highest-level of resolution (150 nm), overlay accuracy (25 nm) and productivity (throughput *121 wph) were achieved among KrF excimer laser steppers in the same class.
- * 200 mm (8 inch) wafer, 60 shots
FPA-3030EX6 steppers are compatible with FPA-3000EX6 reticle and recipes
Compatibility with FPA-3000EX6 reticles and recipes allows effective use of existing facilities and assets.
Specifications
| Resolution | ≦ 150 nm |
|---|---|
| NA (Numerical Aperture) | 0.65～0.50 (Variable) |
| Reduction Ratio | 1:5 |
| Field Size | 22 mm x 22 mm |
| Exposure Wavelength | KrF 248 nm |
| Reticle Size | 6 inch |
| Wafer Size | 100 mm (4 inch), 125 mm (5 inch), 150 mm (6 inch), 200 mm (8 inch) (Selection) |
| Overlay Accuracy | ≦ 25 nm |
| Major Options | Wafer Handling Kit for Special Substrates PC Remote Console GEM-compliant online software Pellicle Particle Checker |