Semiconductor Lithography Equipment


KrF Stepper for IoT devices

  • Features
  • Specifications

Basic Information

Model Name: FPA-3030EX6


FPA-3030EX6 steppers are compatible with a variety of special substrates & small-sized substrates

Equipped with the same Wafer Feeding System as the proven FPA-3030i5+ i-line stepper, the FPA-3030EX6 supports the handling of substrates of various materials, sizes and thicknesses used for manufacturing IoT & power devices.

The FPA-3030EX6 offers the highest level of performance among KrF excimer laser steppers

The performance of previous model FPA-3000EX6 steppers was inherited, and the highest-level of resolution (150 nm), overlay accuracy (25 nm) and productivity (throughput *121 wph) were achieved among KrF excimer laser steppers in the same class.

  • * 200 mm (8 inch) wafer, 60 shots

FPA-3030EX6 steppers are compatible with FPA-3000EX6 reticle and recipes

Compatibility with FPA-3000EX6 reticles and recipes allows effective use of existing facilities and assets.


Resolution ≦ 150 nm
NA (Numerical Aperture) 0.65~0.50 (Variable)
Reduction Ratio 1:5
Field Size 22 mm x 22 mm
Exposure Wavelength KrF 248 nm
Reticle Size 6 inch
Wafer Size 100 mm (4 inch), 125 mm (5 inch), 150 mm (6 inch), 200 mm (8 inch) (Selection)
Overlay Accuracy ≦ 25 nm
Major Options Wafer Handling Kit for Special Substrates
PC Remote Console
GEM-compliant online software
Pellicle Particle Checker