Industrial

Semiconductor lithography equipment for advanced packaging used in the manufacture of semiconductors for AI and other applications

Ultra precision manufacturing equipment underpinning the digital economy

Canon supports global semiconductor and display production with super-precision technology.

The semiconductor device manufacturing process

Broad coverage of semiconductor production processes helps stabilize advanced chip supplies

Semiconductor chips are used in various products. The Canon Group works together to provide a wide range of production equipment. Its lithography equipment forms circuit patterns, while Canon ANELVA’s sputtering equipment forms thin metal films. Canon’s lithography equipment has made a significant contribution to the development of semiconductors for AI applications, particularly in packaging processes that require the integration of multiple functions and precise alignment of fine layers. The company is also at the forefront of advanced lithography that stitches multiple exposure areas to form a single large package, while Canon Machinery’s die bonders securely mount chips on lead frames.

Canon ANELVA’s modular sputtering equipment offers configuration flexibility

Super-precision technology behind the fine resolution of ever-larger high-quality displays

High-definition displays, including those in smartphones, PCs, and 4K and 8K TVs, are ubiquitous and essential in today’s digital society. Canon’s flat-panel display (FPD) lithography equipment, which transfers fine display circuit patterns onto large glass substrates, supports OLED and LCD display production with super-precision technology. Adoption of OLED displays is growing, due to their ability to reproduce deep blacks, as well as their thin, lightweight, and energy-efficient design. Canon Tokki, which realized mass production of OLED displays with world-leading vapor deposition equipment, is focused on developing technology for vapor deposition that works with new production equipment and new materials.

FPD lithography equipment forms circuit patterns by projecting high-resolution images on large substrates

Nanoimprint lithography enables miniaturization while significantly reducing energy consumption for advanced semiconductor production

Semiconductor devices have continued to evolve, achieving higher performance through finer circuit geometries. Canon’s nanoimprint lithography (NIL) technology transfers superfine circuit patterns like a stamp, greatly reducing the power consumed by production processes to approximately one-tenth of conventional methods. It has also developed technology to suppress tiny-particle generation and contamination—a long-standing challenge—and is now pushing toward the cutting-edge 2-nm node.* NIL technology can be applied to wafer surface planarization—a critical process in advanced semiconductor production—providing strong backing for the manufacturing of advanced semiconductors.

  • * Nodes are a naming convention for the generations of semiconductor production process technologies.
Canon's nanoimprint semiconductor production equipment

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