FPA-8000iW

Basic Information

Model Name: FPA-8000iW

Features

i-line stepper "FPA-8000iW" for large panel substrates up to 515 x 510mm

• * Wide exposure field (52 mm x 68 mm or 55 mm x 55 mm).
• * High resolution of 1.0 μm is available across the wide exposure field.
• * High resolution and wide exposure field combine to provide high-productivity and further miniaturization, a larger device size and cost reduction for semiconductor packaging.

Supports high-productivity packaging on large substrates

In response to packaging processes that use panel substrates, Canon developed a new stepper platform capable of handling large 515 x 510 mm panel substrates. Severe warpage is also common in large panel substrates and the new platform and panel-feeding system can overcome up to 10 mm of panel warpage. As a result, the FPA-8000iW can help customers realize high-productivity and efficiency for PLP production of large packages.

Achieves a resolution of 1.0 μm that enables advanced packaging

Canon's original projection optical system supports a wide 52 x 68 mm exposure field while achieving 1.0 μm resolution, which is the finest resolution among packaging exposure systems that support panel substrate processes. As a result, advanced packaging technology such as Panel Level Packaging can innovate to provide high integration and flexibility in electronic system design.