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Semiconductor Lithography Equipment
FPA-8000iW
i-line stepper compatible with large panels at 1.0 μm resolution

  • Features
  • Specifications

Basic Information

Model Name: FPA-8000iW

Features

i-line stepper "FPA-8000iW" for large panel substrates up to 515 x 510mm

  • Wide exposure field (52 mm x 68 mm or 55 mm x 55 mm).
  • High resolution of 1.0 μm is available across the wide exposure field.
  • High resolution and wide exposure field combine to provide high-productivity and further miniaturization, a larger device size and cost reduction for semiconductor packaging.

Supports high-productivity packaging on large substrates

In response to packaging processes that use panel substrates, Canon developed a new stepper platform capable of handling large 515 x 510 mm panel substrates. Severe warpage is also common in large panel substrates and the new platform and panel-feeding system can overcome up to 10 mm of panel warpage. As a result, the FPA-8000iW can help customers realize high-productivity and efficiency for PLP production of large packages.

Achieves a resolution of 1.0 μm that enables advanced packaging

Canon's original projection optical system supports a wide 52 x 68 mm exposure field while achieving 1.0 μm resolution, which is the finest resolution among packaging exposure systems that support panel substrate processes. As a result, advanced packaging technology such as Panel Level Packaging can innovate to provide high integration and flexibility in electronic system design.

Specifications

Resolution
≦ 1.0 µm
NA (Numerical Aperture)
0.24-0.12 (Variable)
Reduction Ratio
1:2
Field Size
52 mm x 68 mm or 55 mm x 55 mm
Exposure Wavelength
i-line 365 nm
Reticle Size
6inch
Substrate Size
De facto size 515 x 510 mm can be processed (Max: 515 x 515 mm)
Overlay Accuracy
≦ 200 nm
Main Body Dimensions
(W) 3,000 × (D) 4,800 × (H) 2,700 mm
Major Options
PC Remote Console
Warped panel handling option (Vacuum Assist Unit)
Resist Outgas Exhaust unit
Pellicle Particle Checker