FPA-3030iWa

Basic Information

Model Name: FPA-3030iWa

Features

The FPA-3030iWa supports smaller substrates which are 200 mm or less in diameter.

• *A wide range of wafer sizes from 50mm (2inch) to 200mm (8inch) are supported.
• *FPA-3030 platform that has already demonstrated high reliability among customers in the market since release.
• *Wide exposure field of 52mm x 52mm is available.

Supports a wide range of needs for manufacturing of various devices and their processes

A 52 mm x 52 mm wide-field projection lens with a variable numerical aperture (NA) ranging from 0.16 to 0.24 delivers a large depth of focus (DOF) and enabling both high-precision exposure and creation of line width patterns with high uniformity.

Supports a variety of different wafer sizes and materials

The FPA-3030iWa can be equipped with a handling system that enables the selection of wafer diameters from 50mm (2inch) to 200mm (8inch) to support a variety of different compound semiconductor wafer sizes and materials.

Adopts an off-axis alignment scope with enhanced robustness

The FPA-3030iWa employs an off-axis alignment scope that measures wafer alignment marks through an optical path that does not pass through the projection lens. This allows the off-axis alignment system to use a wide range of alignment illumination wavelengths, providing robust alignment process optimization.

Improved throughput through newly redesigned hardware and software

The system updates make the FPA-3030iWa compatible with new options including wafer transfer functions supporting warped and transparent wafer processes such as silicon carbide and alignment system options that allow simultaneous X & Y alignment mark measurement to increase stepper productivity.