Semiconductor Lithography Equipment
FPA-6300ES6a
High Resolution / High Productivity KrF Scanner
- Features
- Specifications
- Video
Basic Information
Model Name: FPA-6300ES6a
Features
FPA-6300ES6a scanners deliver High-Productivity
Processing time was reduced by speeding up the exposure process with a new-design Reticle & Wafer Stages, by improving alignment sequences and wafer handling time reduction. The throughput of the FPA-6300ES6a is over *200 wph (wafers per hour) which is 1.6 times higher productivity than previous FPA-6000ES6a model scanners.
- * 300 mm (12 inch) wafer, 98 shots, with Options applied
FPA-6300ES6a scanners realize industry-leading Overlay Accuracy
To minimize overlay misalignment & intrafield distortion during exposure, advanced stage vibration & synchronous control technologies were adopted in the FPA-6300ES6a. The alignment scope was also improved in order to measure the alignment marks on a wafer more accurately.
Furthermore, by accurately controlling the temperature of the exposure area and the reticle area, **industry-leading Mix & Match overlay accuracy of ≤ 5nm has been realized.
- * *as of December 14, 2016 (Examination by Canon), with Options applied
FPA-6300ES6a scanners provide high-reliability
The FPA-6300ES6a platform provides substantial improvements in terms of base durability and maintenance requirements, as well as reduced install times and increased system uptime and availability when compared to earlier FPA-6000 Platform scanners. FPA-6300ES6a options and upgrades further improve overlay accuracy and productivity, offering scalability to support next-generation semiconductor manufacturing.
Specifications
| Resolution | ≦ 90 nm |
|---|---|
| NA (Numerical Aperture) | 0.86~0.50 (Variable) |
| Reduction Ratio | 1:4 |
| Field Size | 26 mm x 33 mm |
| Exposure Wavelength | KrF 248 nm |
| Reticle Size | 6 inch |
| Wafer Size | 200 mm (8 inch), 300 mm (12 inch) (Selection) |
| Overlay Accuracy | ≦ *5 nm |
| Main Body Dimensions | (W) 2,300 x (D) 5,155 x (H) 2,900 mm |
| Major Options | Various Mix & Match Overlay Improvement Options Various Throughput Improvement Options Various CD Uniformity Improvement Options Focus Accuracy Improvement Option (F-MAP) Focus Spot Automatic Chuck Cleaning Various Productivity Improvement Options AFIS Illumination System SMIF OHT Kit PC Remote Console GEM-compliant online software Pellicle Particle Checker |
- * = Options Required
Video
*In order to view videos, it is necessary to consent to the use of cookies by our website. If the videos are not displayed, please click the "Cookie Settings" and accept cookies.