FPA-6300ES6a

Basic Information

Model Name: FPA-6300ES6a

Features

FPA-6300ES6a scanners deliver High-Productivity

Processing time was reduced by speeding up the exposure process with a new-design Reticle & Wafer Stages, by improving alignment sequences and wafer handling time reduction. The throughput of the FPA-6300ES6a is over *200 wph (wafers per hour) which is 1.6 times higher productivity than previous FPA-6000ES6a model scanners.

• * 300 mm (12 inch) wafer, 98 shots, with Options applied

FPA-6300ES6a scanners realize industry-leading Overlay Accuracy

To minimize overlay misalignment & intrafield distortion during exposure, advanced stage vibration & synchronous control technologies were adopted in the FPA-6300ES6a. The alignment scope was also improved in order to measure the alignment marks on a wafer more accurately.
Furthermore, by accurately controlling the temperature of the exposure area and the reticle area, **industry-leading Mix & Match overlay accuracy of ≤ 5nm has been realized.

• * *as of December 14, 2016 (Examination by Canon), with Options applied

FPA-6300ES6a scanners provide high-reliability

The FPA-6300ES6a platform provides substantial improvements in terms of base durability and maintenance requirements, as well as reduced install times and increased system uptime and availability when compared to earlier FPA-6000 Platform scanners. FPA-6300ES6a options and upgrades further improve overlay accuracy and productivity, offering scalability to support next-generation semiconductor manufacturing.