Semiconductor Lithography Equipment
FPA-6300ES6a
High Resolution / High Productivity KrF Scanner
- Features
- Specifications
- Video
Basic Information
Model Name: FPA-6300ES6a
Features
FPA-6300ES6a scanners deliver High-Productivity
Processing time was reduced by speeding up the exposure process with a new-design Reticle & Wafer Stages, by improving alignment sequences and wafer handling time reduction. The throughput of the FPA-6300ES6a is over *200 wph (wafers per hour) which is 1.6 times higher productivity than previous FPA-6000ES6a model scanners.
- * 300 mm (12 inch) wafer, 98 shots, with Options applied
FPA-6300ES6a scanners realize industry-leading Overlay Accuracy
To minimize overlay misalignment & intrafield distortion during exposure, advanced stage vibration & synchronous control technologies were adopted in the FPA-6300ES6a. The alignment scope was also improved in order to measure the alignment marks on a wafer more accurately.
Furthermore, by accurately controlling the temperature of the exposure area and the reticle area, **industry-leading Mix & Match overlay accuracy of ≤ 5nm has been realized.
- * *as of December 14, 2016 (Examination by Canon), with Options applied
FPA-6300ES6a scanners provide high-reliability
The FPA-6300ES6a platform provides substantial improvements in terms of base durability and maintenance requirements, as well as reduced install times and increased system uptime and availability when compared to earlier FPA-6000 Platform scanners. FPA-6300ES6a options and upgrades further improve overlay accuracy and productivity, offering scalability to support next-generation semiconductor manufacturing.
Specifications
| Resolution | ≦ 90 nm |
|---|---|
| NA (Numerical Aperture) | 0.86~0.50 (Variable) |
| Reduction Ratio | 1:4 |
| Field Size | 26 mm x 33 mm |
| Exposure Wavelength | KrF 248 nm |
| Reticle Size | 6 inch |
| Wafer Size | 200 mm (8 inch), 300 mm (12 inch) (Selection) |
| Overlay Accuracy | ≦ *5 nm |
| Main Body Dimensions | (W) 2,300 x (D) 5,155 x (H) 2,900 mm |
| Major Options | Various Mix & Match Overlay Improvement Options Various Throughput Improvement Options Various CD Uniformity Improvement Options Focus Accuracy Improvement Option (F-MAP) Focus Spot Automatic Chuck Cleaning Various Productivity Improvement Options AFIS Illumination System SMIF OHT Kit PC Remote Console GEM-compliant online software Pellicle Particle Checker |
- * = Options Required