The Environmental Approaches and Initiatives of Four Business Groups
Initiatives of the Industrial Group

At the Industrial Group, our mission is to support the future of humanity and the world through manufacturing innovations. To achieve this, we utilize our groundbreaking industrial machinery to co-create new values with our customers. By integrating proprietary optical and image processing technologies, refined over many years, into our industrial equipment, we have developed products that meet the diverse needs of the industrial sector.

Goals

Decarbonization (reducing CO2 emissions)

We aim to reduce per wafer raw materials and operational CO2 emissions in our i-line lithography equipment*1 and KrF lithography equipment*2 by 50% by 2030 (compared to 2008 levels for the i-line, and to 2009 levels for the KrF lithography equipment).

  • *1: FPA-5550iZ series
  • *2: FPA-6000ES6a series
Reduce raw materials and use CO2 emissions per wafer by 50%  for i-line and KrF lithography equipment by 2030. By 50% by 2030(compared to 2008 levels for i-line, and to 2009 levels for KrF lithography equipment)

Resource Efficiency (extending product lifespans)

We are working to extend the lifespans of our products. Our goal is to ensure that 95% or more of the i-line and KrF lithography equipment shipped in 2001 or later is still active by 2030.

Extending product lifespans For i-line and KrF lithography equipment shipped in 2001 or later Ensure 95% or more is still active in 2030

Strategy

Decarbonization

Since operational CO2 emissions account for the majority of the lifetime CO2 emissions of our products, we are working to reduce operational energy consumption.
Given that cutting-edge logic semiconductor production plants consume large amounts of electricity, we plan to install energy-efficient nanoimprint semiconductor manufacturing equipment.

Resource efficiency

By providing the parts and software required to extend the lifespans of our products, we help reduce waste. We are also working to develop products that encourage recycling.

FPA-6000ES6a series Per wafer raw materials and operational CO2 emissions
FPA-6000ES6a series
Raw materials and use CO2 emissions per wafer

Measures

Product Lifecycle
Product Lifecycle
1. Measures for raw materials

Through the use of 3D modeling, we have reduced the size and weight of our parts and therefore reduced the volume of raw materials required.

2. Measures for production

We have achieved a 20% reduction in energy use through energy network tie-ups with other companies.

4. Measures for use and maintenance

Through the use of regenerative energy, we intend to optimize our energy use and reduce energy consumption during peak times.

4. Measures for use and maintenance

We intend to reduce energy loss during transmission by ensuring compatibility with high voltages, and so reduce our energy consumption.

5. Measures for disposal and recycling

Through the launch of the TR-S1510 plastic sorting equipment, we intend to promote recycling.

5. Measures for disposal and recycling

We intend to extend the lifespans of our products by providing new electronic parts and software for existing equipment.