FPA-5520iV / HR Option /
LF Option / LF2 Option

Basic Information

Model Name: FPA-5520iV / HR Option / LF Option / LF2 Option

Features

FPA-5520iV addresses next-generation packaging production challenges including Fan Out Wafer Level Packaging [FOWLP]

FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome.

• *FPA-5520iV steppers employ a wafer handling system with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates.
• *FPA-5520iV stepper wafer stages adopt a new wafer chucking system with increased suction to secure and flatten substrates, allowing high optical performance.
• *FPA-5520iV steppers utilize a new wide-field alignment scope with a field-of-view that is doubled vs. FPA-5510iV steppers, making automatic wafer alignment possible when wafers contain large amounts of die shift, to improve equipment utilization and productivity.

FPA-5520iV is a high performance i-line stepper

FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers.*
FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers. FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as **20%.

• *Among same-class i-line steppers. As of July 4, 2016 (Examination by Canon)
• **Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose

FPA-5520iV inherits the benefits proven by the FPA-5510iV stepper

FPA-5520iV steppers inherit the proven high-resolution projection lens and imaging performance of the FPA-5510iV stepper.
FPA-5520iV steppers provide the same alignment system options as FPA-5510iV steppers to deliver robust and accurate overlay performance.
FPA-5520iV steppers adopt FPA-5510iV stepper console software with common operation procedures and easy recipe conversion.

FPA-5520iV HR Option achieves resolution of 0.8µm to support the advanced packaging process

In response to the growing demand for high-density redistribution layer wiring in the FOWLP market, "FPA-5520iV HR option" has been released since December 2018. The FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8µm, the finest resolution available in packaging-oriented lithography systems.

• * Among same-class i-line steppers. With flatess equal to Si wafer. As of December 10, 2018. Based on a Canon survey.

FPA-5520iV LF Option realizes a single exposure with large field of 52×68mm

Equipped with a new projection optical system, a single exposure with large field of 52×68mm, which is more than 4 times the standard exposure field (26×33mm) of the lithography system in front-end process. This makes it possible to support heterogeneous integration where multiple large semiconductor chips are bonded.

FPA-5520iV LF2 Option contributes to 3D advanced packaging technologies with exposure fields of up to 100×100mm

The new FPA-5520iV LF2 Option features a fine 0.8µm resolution and 4-shot exposure with minimal distortion to make possible a wide 100×100mm exposure field. This in turn enables mass production of large and dense packaging with fine circuit patterns that integrate 2.5D and 3D technology.