Semiconductor Lithography EquipmentFPA-5520iV / FPA-5520iV HR Optioni-line stepper for advanced packaging enhanced for FOWLP applications with high productivity
Model Name: FPA-5520iV / FPA-5520iV HR Option
FPA-5520iV addresses next-generation packaging production challenges including Fan Out Wafer Level Packaging [FOWLP]
FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome.
FPA-5520iV steppers employ a wafer handling system with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates.
FPA-5520iV stepper wafer stages adopt a new wafer chucking system with increased suction to secure and flatten substrates, allowing high optical performance.
FPA-5520iV steppers utilize a new wide-field alignment scope with a field-of-view that is doubled vs. FPA-5510iV steppers, making automatic wafer alignment possible when wafers contain large amounts of die shift, to improve equipment utilization and productivity.
FPA-5520iV is a high performance i-line stepper
FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers.*
FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers. FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as **20%.
- *Among same-class i-line steppers. As of July 4, 2016 (Examination by Canon)
- **Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose
FPA-5520iV inherits the benefits proven by the FPA-5510iV stepper
FPA-5520iV steppers inherit the proven high-resolution projection lens and imaging performance of the FPA-5510iV stepper.
FPA-5520iV steppers provide the same alignment system options as FPA-5510iV steppers to deliver robust and accurate overlay performance.
FPA-5520iV steppers adopt FPA-5510iV stepper console software with common operation procedures and easy recipe conversion.
FPA-5520iV HR Option achieves resolution of 0.8um to support the advanced packaging process
In response to the growing demand for high-density redistribution layer wiring in the FOWLP market, "FPA-5520iV HR option" has been released since December 2018. The FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8µm, the finest resolution available in packaging-oriented lithography systems.
- * Among same-class i-line steppers. With flatess equal to Si wafer. As of December 10, 2018. Based on a Canon survey.
- FPA-5520iV: ≦1µm
FPA-5520iV HR Option: ≦0.8µm
- Reduction Ratio
- Field Size
- 52 mm x 34 mm
- Exposure Wavelength
- i-Line 365nm
- Reticle Size
- 6 inch
- Wafer Size
- 300 mm (12 inch)
- Overlay Accuracy
- ≦ 150 nm
- Main Body Dimensions
- (W) 2,300 x (D) 3,340 x (H) 2,700 mm
- Major Options
- Through-Silicon Alignment Scope (TSA-Scope)
Wafer Edge Shielding Unit
Wafer Edge Exposure Unit
Resist Outgas Exhaust Unit
PC Remote Console
Pellicle Particle Checker
Illumination System Purge Unit